Germany's Henkel to open chip packaging materials R&D center in Seoul
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German adhesives and materials maker Henkel will set up a research center in Seoul to develop packaging materials for artificial intelligence (AI) chips and high-bandwidth memory (HBM), the Seoul Metropolitan Government said Monday. The city signed a memorandum of understanding with the company at Seoul City Hall on Monday. Under the agreement, Henkel will make 12.1 billion won ($8.9 million) in foreign direct investment in Seoul by 2031 and hire 15 new researchers, including holders of master’s
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