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Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC - digitimes

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Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC  digitimesmotorola signature 27  motorolanews.comSnapdragon Leads the Agentic AI Age with Two of the World’s Fastest Mobile SoCs Powering the Next Generation of Smartphones  QualcommQualcomm launches two new smartphone chips with emphasis on AI  TechCrunchQualcomm’s new chip tackles the AI memory crunch  YourStory.com

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