SK hynix unveils self-cooling iHBM chips to combat AI overheating
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SK hynix on Tuesday revealed its new high bandwidth memory technology iHBM, which embeds a proprietary cooling element inside the HBM package to substantially reduce heat generation in artificial intelligence (AI) computing environments. The company said heat management has become a critical bottleneck as HBM stacks more layers and operates at higher speeds to keep pace with surging AI workload demand. Heat concentration is most acute at the die-to-die physical layer (D2D PHY), the high-speed da
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