The Chip Packaging IP That Export Controls Cannot Reach
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Executive Summary:
Semiconductor packaging giant Tongfu Microelectronics holds a permanent, royalty-free license to intellectual property from U.S. fabless manufacturer AMD. This license was granted in 2016 with PRC state backing from the National Integrated Circuit Industry Investment Fund.
U.S. export controls on semiconductor packaging, introduced in 2025, cannot reach technology permanently transferred by contract nine years earlier.
The license permits the use of AMD’s technology
Semiconductor packaging giant Tongfu Microelectronics holds a permanent, royalty-free license to intellectual property from U.S. fabless manufacturer AMD. This license was granted in 2016 with PRC state backing from the National Integrated Circuit Industry Investment Fund.
U.S. export controls on semiconductor packaging, introduced in 2025, cannot reach technology permanently transferred by contract nine years earlier.
The license permits the use of AMD’s technology
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